Tell me about a time when insufficient or excessive paste causes solder defects. What did you do?

I first confirmed the facts and contained the immediate impact. Next, I reviewed SPI data, stencil record, and paste control log and coordinated the action to verify stencil thickness, aperture, paste condition, and print parameters. After verifying the result, I summarized the root cause, preventive control, owner, and follow-up plan so the issue would not recur.