Tell me about a time when bridging, insufficient solder, or thermal damage occurs. What did you do?

I first confirmed the facts and contained the immediate impact. Next, I reviewed process parameter record and solder defect trend and coordinated the action to verify flux, preheat, solder temperature, conveyor speed, and contact time. After verifying the result, I summarized the root cause, preventive control, owner, and follow-up plan so the issue would not recur.